Power Device
The Metal/Insulation-substrate/Metal three-layer structure design is a solution for addressing heat dissipation issues in power components, offering excellent thermal conductivity and high-voltage insulation.
Using a unique metal film deposition technology, various substrates can be matched, offering more adaptable solutions and better life cycles.
Features
- Using substrates with high thermal conductivity and high-voltage insulation, metal bonding processes are carried out.
- The optimal ratio of metal layer and substrate thickness can be adjusted to suit the thermal expansion coefficient (CTE) requirements of various laser chips.
- Custom solder pattern designs can be provided.
- Substrates can be chosen from various materials： Al2O3、ZTA、AlN、SiNx…
- Metal can be chosen from various materials： Ti、Cu、Ni、Au、Pt、Pd、AuSn
Application
- Consumer products: Variable frequency air conditioners/refrigerators, etc
- Industrial-grade energy conversion systems: High-voltage power towers, etc
- Automotive electronics: Electric vehicles, etc