High Frequency Device
Unique metal film deposition technology, combined with custom material layers, through-holes, and low dielectric loss manufacturing, provides high-frequency, high-speed, low-impedance, and durable transmission structures, ensuring signal stability and integrity.
Aluminum nitride ceramic circuit boards, made using thin film technology, can be used in industrial communications and other integrated heat-dissipation circuits.
Features
- Using substrates with high frequency, high speed, low impedance, high thermal conductivity, and high insulation for metal bonding processes.
- The optimal ratio of metal layer and substrate thickness can be adjusted to meet the thermal expansion coefficient (CTE) requirements for various high-frequency components.
- Custom material layers, through-holes, and low-dielectric-loss substrates can be provided.
- Thin film resistors (TaXN) that match various system impedances can be provided.
- Custom designs for solder patterns can be provided.
- Substrates can be chosen from various materials： Al₂O₃、AlN
- Metal materials can be chosen from various options： Ti、Cu、Au、Pt、Pd、W、AuSn
Application
- To-can Encapsulated components
- Vcsel Encapsulated components
- High-frequency communication products: optical transceiver modules (TOSA, ROSA), 5G base stations, etc.