product Sub-Mount MetalEdge Emitting Laser The Metal/Insulation-substrate/Metal three-layer structure design is a solution to the heat dissipation problem of high-power laser chips and has good thermal conductivity and insulation.High Frequency Device Unique metal film formation technology combined with customized material interlayers, through holes and low dielectric loss production can provide a high-frequency, high-speed, low-impedance and good component life cycle message transmission structure to ensure message stability and integrity. Power Device The Metal/Insulation-substrate/Metal three-layer structure design is a solution to the heat dissipation problem of power components. It also has the advantages of good thermal conductivity and high-voltage insulation resistance.Foundry ServicePhysical vapor deposition(PVD) Plating layer: Cu/Ni/Ti/Pt/Au...etc.Chemical/Electroless Plating Plating layer: Cu/Ni/Ti/Pt/Au/AuSn...etc.Photo service The pattern accuracy reaches 10µm. The exposure area can reach 8 inches.Dry etching service Be etched: Si/SiO2/SiC/Cr... and other thin films.Wet etching service Be etched: Cu/Ni/Ti/Au...and other thin films.
